2025 Vol.8 Feb.N01

• Title: Exploration of the Integration Path of Industry and Education in Mechanical and Electrical Engineering under the Background of I
• Name: Shiping Liu
• Company: Shandong Vocational College of Science and Technology, weifang 261053，China
• Abstract:

   With the rapid development of information technology, the electromechanical industry is facing profound changes, and the demand for talent is also increasing day by day. This article deeply analyzes the characteristics of multidisciplinary integration and strong practicality in the field of electromechanical engineering, as well as the demand for talents in knowledge, skills, and innovation ability in the electromechanical industry under the background of informatization. By studying the current situation of the integration of industry and education in the field of mechanical and electrical engineering, it is pointed out that there are problems such as policy implementation, disconnection between teaching and industry, and insufficient enthusiasm for enterprise participation. Furthermore, a path for the integration of industry and education in the field of mechatronics under the background of informatization has been constructed, including improving policy support, reforming the curriculum system, building a dual teacher teacher team, deepening cooperation between schools and enterprises, and constructing information technology training bases. The aim is to improve the quality of the integration of industry and education in mechatronics and provide reference for cultivating mechatronics professionals who can adapt to the needs of the information age.

  
  

• Keyword: Promotion of information technology; Mechanical and Electrical Engineering major; Integration of industry and education;
• DOI: 10.12250/jpciams2025090220
• Citation form: Tianwen Zhou.Exploration of the Integration Path of Industry and Education in Mechanical and Electrical Engineering under the Background of Informatization[J]. Computer Informatization and Mechanical System,2025,Vol.8,pp.84-88

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